IEC 62137-4-ed.1.0

Detail information

Designation: IEC 62137-4-ed.1.0

Publication date: 09/10/2014

Pages: 85

Country: International technical standard

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Anotation

IEC 62137-4:2014 specifies the test method for the solder joints of area array type packages mounted on the printed wiring board to evaluate solder joint durability against thermo-mechanical stress. This part of IEC 62137 applies to the surface mounting semiconductor devices with area array type packages (FBGA, BGA, FLGA and LGA) including peripheral termination type packages (SON and QFN) that are intended to be used in industrial and consumer electrical or electronic equipment. IEC 62137-4 includes the following significant technical changes with respect to IEC 62137:2004: - test conditions for use of lead-free solder are included; - test conditions for lead-free solders are added; - accelerations of the temperature cycling test for solder joints are added. LIEC 62137-4:2014 specifie la methode dessai des joints brases des boitiers de type matriciel montes sur la carte de cablage imprime, visant a evaluer la durabilite des joints brases par rapport aux contraintes thermiques et mecaniques. La presente partie de lIEC 62137 sapplique aux dispositifs a semiconducteurs pour montage en surface avec boitiers de type matriciel (FBGA, BGA, FLGA et LGA) incluant les boitiers de type a bornes peripheriques (SON et QFN) qui sont destines a etre utilises dans des materiels electriques ou electroniques industriels ou grand public. LIEC 62137-4 inclut les modifications techniques majeures suivantes par rapport a lIEC 62137:2004: - les conditions dessai pour lutilisation dune soudure sans plomb ont ete incluses; - les conditions dessai pour des soudures sans plomb ont ete ajoutees; - les accelerations de lessai de cycle de temperature pour des joints brases ont ete ajoutees.