IEC 62258-1-ed.2.0

Detail information

Designation: IEC 62258-1-ed.2.0

Publication date: 07/04/2009

Pages: 90

Country: International technical standard

Where to buy?

You can buy at www.mystandards.biz

Anotation

IEC 62258-1:2009 has been developed to facilitate the production, supply and use of semiconductor die products, including: - wafers, - singulated bare die, - die and wafers with attached connection structures, - minimally or partially encapsulated die and wafers. This standard defines the minimum requirements for the data that are needed to describe such die products and is intended as an aid to the design of and procurement for assemblies incorporating die products. It covers the requirements for data, including: - product identity, - product data, - die mechanical information, - test, quality, assembly and reliability information, - handling, shipping and storage information. The main changes that have been introduced in this edition have been to ensure consistency across all parts of the standard. The ordering of the subclauses, particularly in Clause 6, has been changed to be more logical and the text of some of the requirements has been amended to add requirements on further information as covered by IEC/TR 62258-4, IEC/TR 62258-7 and IEC/TR 62258-8. New requirements include information on permutability of terminals and functional elements (6.6.4) and moisture sensitivity for partially encapsulated devices (8.8). La CEI 62258-1:2009 a ete elaboree afin de faciliter la production, la fourniture et lutilisation de produits de puces de semi-conducteurs, y compris: - lest tranches, - les puces nues isolees, - les puces et tranches munies de leurs structures de connexion, - les puces et tranches a encapsulation minimale ou partielle. Cette norme definit les exigences minimales applicables aux donnees necessaires a la description desdits produits de puces et constitue une aide a la conception et a lapprovisionnement densembles integrant des produits de puces. Les exigences ainsi couvertes comprennent: - lidentification du produit, - les donnees du produit, - les informations mecaniques concernant les puces, - les informations concernant les essais, la qualite, lassemblage et la fiabilite, - les informations relatives a la manifulation, a lexpedition et au stockage. Les principales modifications ayant ete introduites dans la presente edition sont destinees a assurer la coherence entre toutes les parties de la norme. Lordre des paragraphes, notamment a lArticle 6, a ete modifie de maniere a etre plus logique, et le texte de certaines des exigences, a ete amende de maniere a ajouter les exigences relatives aux informations supplementaires objet de la CEI/TR 62258-4, de la CEI/TR 62258-7 et de la CEI/TR 62258-8. Les nouvelles exigences comprennent les informations sur la permutabilite des bornes et des elements fonctionnels (6.6.4) et surla sensibilite a lhumidite des dispositifs partiellement encapsules (8.8).