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Active standard | Published: 28/08/2006
IEC 62258-6-ed.1.0
Semiconductor die products - Part 6: Requirements for information concerning thermal simulation
Available languages: English
Available design: electronic design (pdf), Print design, CD-ROM
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Detail information
Designation: IEC 62258-6-ed.1.0
Publication date: 28/08/2006
Pages: 9
Country: International technical standard
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Determines the information required to facilitate the use of thermal data and models for simulation of the thermal behaviour and verification of the correct functionality of electronic systems that include bare semiconductor die, with or without connection structures, and/or minimally packaged semiconductor die. Intends to assist all those involved in the supply chain for die devices to comply with the requirements of IEC 62258-1 and IEC 62258-2Popular Publishers
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