IEC 62769-4-ed.3.0

Detail information

Designation: IEC 62769-4-ed.3.0

Publication date: 05/04/2023

Pages: 181

Country: International technical standard

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Anotation

IEC 62769-4:2023 specifies the FDI®[1] Packages. The overall FDI® architecture is illustrated in Figure 1. The architectural components that are within the scope of this document have been highlighted in Architecture diagram figure. [1] FDI® is a registered trademark of the non-profit organization Fieldbus Foundation, Inc. This information is given for the convenience of users of this document and does not constitute an endorsement by IEC of the trademark holder or any of its products. Compliance does not require use of the trade name. Use of the trade name requires permission of the trade name holder. LIEC 62769-4:2023 specifie les Paquetages FDI®[1]. Larchitecture FDI® complete est representee a la Figure 1. Les composants architecturaux qui relevent du domaine dapplication du present document ont ete mis en evidence dans Diagramme de larchitecture figure. [1] FDI® est une marque deposee de l’organisation a but non lucratif Fieldbus Foundation, Inc. Cette information est donnee a lintention des utilisateurs du present document et ne signifie nullement que lIEC approuve le detenteur de la marque ou lemploi de ses produits. La conformite nexige pas lutilisation de la marque. Lutilisation de la marque exige lautorisation du detenteur de la marque.