Active standard | Published: 25/02/2025

IEC 62878-2-603-ed.1.0

Device embedding assembly technology - Part 2-603: Guideline for stacked electronic module - Test method of intra-module electrical connectivity
(Techniques d’assemblage avec appareil(s) integre(s) - Partie 2-603: Lignes directrices pour un empilement de modules electroniques - Methode d’essai de la connectivite electrique entre modules)

Available languages: English and French

Available design: electronic design (pdf), Print design, CD-ROM

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Detail information

Designation: IEC 62878-2-603-ed.1.0

Publication date: 25/02/2025

Pages: 0

Country: International technical standard

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Anotation

IEC 62878-2-603:2025 specifies the electrical test method to detect electrical connectivity defects of the stacked electronic module caused by the stacking assembly process to stack some stackable electronic modules. This method is realized to make use of bidirectional serial communication bus interface applied to the stackable electronic modules which are assured as "known good module" (KGM). LIEC 62878-2-603:2025 specifie la methode electrique dessai qui permet de detecter les defauts de connectivite electrique de l’empilement de modules electroniques provoques par le processus dassemblage par empilage d’un certain nombre de modules electroniques empilables. Cette methode est mise en ouvre afin d’utiliser linterface de bus de communication serie bidirectionnelle appliquee aux modules electroniques empilables qui sont garantis comme etant des modules reputes conformes (KGM – Known Good Module).

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