Active standard | Published: 28/11/2018

IEC 63011-2-ed.1.0

Integrated circuits - Three dimensional integrated circuits - Part 2: Alignment of stacked dies having fine pitch interconnect
(Circuits integres - Circuits integres tridimensionnels - Partie 2: Alignement de puces empilees a petits pas d´interconnexion)

Available languages: English and French

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Detail information

Designation: IEC 63011-2-ed.1.0

Publication date: 28/11/2018

Pages: 28

Country: International technical standard

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Anotation

IEC 63011-2:2018 provides specifications of initial alignment and alignment maintenance between multiple stacked integrated circuits during the die bonding process. These specifications define the alignment keys and operating procedures of the keys. These specifications apply only if electrical coupling method of die-to-die alignment is used in the die stacking. LIEC 63011-2:2018 donne des specifications dalignement initial et de maintien dalignement entre plusieurs circuits integres empiles pendant le processus de liaison de puces. Ces specifications definissent les cles dalignement et les procedures de fonctionnement de ces cles. Ces specifications sappliquent uniquement si une methode de couplage electrique dalignement de puces les unes sur les autres est utilisee dans lempilement des puces.

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