Active standard | Published: 01/11/2023

IEC 63251-ed.1.0

Test method for mechanical properties of flexible opto-electric circuit boards under thermal stress
(Methode d’essai des proprietes mecaniques des circuits optoelectriques souples sous contrainte thermique)

Available languages: English and French

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Detail information

Designation: IEC 63251-ed.1.0

Publication date: 01/11/2023

Pages: 42

Country: International technical standard

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Anotation

IEC 63251:2023 defines the thermal endurance test methods for reliability assessment of flexible opto-electric circuit boards. The purpose of this document is to accommodate the uniform thermal characteristics required by the flexible opto-electric circuit in high temperature environments such as automobiles. In particular, this document specifies a test method to inspect the occurrence of colour exchange, deformation and delamination of flexible opto-electric circuit boards under thermal stress. LIEC 63251:2023 definit les methodes d’essai d’endurance thermique relatives a l’evaluation de la fiabilite des circuits optoelectriques souples. Le present document a pour objet de tenir compte des caracteristiques thermiques uniformes exigees par le circuit optoelectrique souple dans les environnements a haute temperature comme les automobiles. Le present document specifie notamment une methode d’essai pour deceler l’apparition d’un changement de couleur, d’une deformation et d’une destratification des circuits optoelectriques souples sous contrainte thermique.

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