Active standard | Published: 06/05/2025

IEC 63378-3-ed.1.0

Thermal standardization on semiconductor packages - Part 3: Thermal circuit simulation models of discrete semiconductor packages for transient analysis
(Normalisation thermique des boitiers de semiconducteurs - Partie 3: Modeles de simulation de circuits thermiques de boitiers de semiconducteurs discrets pour analyse transitoire)

Available languages: English and French

Available design: electronic design (pdf), Print design, CD-ROM

from 2 497.40 CZK show on eshop

Detail information

Designation: IEC 63378-3-ed.1.0

Publication date: 06/05/2025

Pages: 29

Country: International technical standard

Where to buy?

You can buy at www.mystandards.biz

Anotation

IEC 63378-3:2025 specifies the thermal circuit network model of discrete (TO-243, TO-252 and TO-263) packages, which is used in the transient analysis of electronic devices to estimate precise junction temperatures without experimental verification. This model is intended to be made and provided by semiconductor suppliers and to be used by assembly makers of electronic devices. L’IEC 63378-3:2025 specifie le modele de reseau de circuits thermiques des boitiers discrets (TO-243, TO-252 et TO-263), qui est utilise dans l’analyse transitoire des dispositifs electroniques pour estimer avec precision les temperatures de jonction sans verification experimentale. Ce modele est destine a etre fabrique et fourni par les fournisseurs de semiconducteurs, et a etre utilise par les assembleurs de dispositifs electroniques.

Popular Publishers

full catalog