Active standard | Published: 16/10/2023

ISO 8181:2023

Atomic layer deposition — Vocabulary
(Dépôt de couches atomiques — Vocabulaire)

Available languages: English

Available design: electronic design (pdf), Print design

from 2 073.70 CZK show on eshop

Detail information

Designation: ISO 8181:2023

Publication date: 16/10/2023

Pages: 10

Country: International technical standard

Where to buy?

You can buy at www.mystandards.biz

Anotation

Description / Abstract: This document defines general terms and film growth processes for atomic layer deposition (ALD). ALD technique is classified into conventional time separated ALD and spatial ALD according to the separation between sequential surface reactions of precursors on substrate. Besides planar substrate, ALD can be used for coating on micro-nano particles, which is developed as powder ALD. Some energy enhanced ALD techniques are also included. This document specifies the processes of different ALD methods. This document applies to the process of ALD. This document does not apply to the deposited materials or specific nanostructures. This document applies to industrial production, scientific research, teaching, publishing and scientific and technological communications related to ALD.

Popular Publishers

full catalog