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Active standard | Published: 01/01/2022
STN EN IEC 61189-2-807
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-807: Test methods for materials for interconnection structures - Decomposition temperature (Td) using TGA
Available languages: English
Available design: Print design
Detail information
Designation: STN EN IEC 61189-2-807
Publication date: 01/01/2022
Pages: 0
Country: Slovak technical standard
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