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Active standard | Published: 01/04/2026
STN EN IEC 61189-3-302
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-302: Detection of plating defects in unpopulated circuit boards by computed tomography (CT)
Available languages: English
Available design: Print design
Detail information
Designation: STN EN IEC 61189-3-302
Publication date: 01/04/2026
Pages: 0
Country: Slovak technical standard
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