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Active standard | Published: 01/10/2003
UNE-EN 60191-6-4:2003
Mechanical standardization of semiconductor devices -- Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of ball grid array (BGA) (Endorsed by AENOR in October of 2003.)
Available languages: English
Available design: electronic design (pdf), Print design
from 71.20 USD
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Detail information
Designation: UNE-EN 60191-6-4:2003
Publication date: 01/10/2003
Pages: 20
Country: Spanish technical standard
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