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Stránka 2732
Environmental testing - Part 2-58: Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
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Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
Dostupné prevedenie: Tlačené
Environmental testing. Part 2: Test methods - Test Fe: Vibration - Sine-beat method
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Environmental testing - Part 2: Tests - Test Ke: Flowing mixed gas corrosion test
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Environmental testing. Part 2: Test methods. Test Fh: Vibration, broad-band random (digital control) and guidance
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Environmental testing. Part 2: Methods of test. Test Fg: Vibration, acxoustically induced
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Environmental testing - Part 2: Tests - Test Te: Solderability testing of electronic components for surface mount technology by the wetting balance method
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