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Stránka 3414
Materials for printed boards and other interconnecting structures - Part 4-14: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
Dostupné jazyky: Anglicky (v českom jazyku len titulná strana)
Dostupné prevedenie: Tlačené
Materials for printed boards and other interconnecting structures - Part 4-15: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Multifunctional epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
Dostupné jazyky: Anglicky (v českom jazyku len titulná strana)
Dostupné prevedenie: Tlačené
Materials for printed boards and other interconnecting structures - Part 4-16: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Multifunctional non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
Dostupné jazyky: Anglicky (v českom jazyku len titulná strana)
Dostupné prevedenie: Tlačené
Materials for printed boards and other interconnecting structures - Part 4-17: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
Dostupné jazyky: Anglicky (v českom jazyku len titulná strana)
Dostupné prevedenie: Tlačené
Materials for printed boards and other interconnecting structures - Part 3-3: Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards) - Adhesive coated flexible polyester film
Dostupné jazyky: Len český predhovor
Dostupné prevedenie: Tlačené
Materials for printed boards and other interconnecting structures - Part 3-4: Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards) - Adhesive coated flexible polyimide film
Dostupné jazyky: Len český predhovor
Dostupné prevedenie: Tlačené
Materials for printed boards and other interconnecting structures - Part 3-5: Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards) - Transfer adhesive films
Dostupné jazyky: Len český predhovor
Dostupné prevedenie: Tlačené
Materials for printed boards and other interconnecting structures - Part 4-1: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Epoxide woven E-glass prepreg of defined flammability
Dostupné jazyky: Anglicky (v českom jazyku len titulná strana)
Dostupné prevedenie: Tlačené
Materials for printed boards and other interconnecting structures - Part 4-2: Sectional specification set for prepreg materials, unclad - Multifunctional epoxide woven E-glass prepreg of defined flammability
Dostupné jazyky: Anglicky (v českom jazyku len titulná strana)
Dostupné prevedenie: Tlačené
Materials for printed boards and other interconnecting structures - Part 4-5: Sectional specification set for prepreg materials, unclad - Polyimide, modified or unmodified, woven E-glass prepreg of defined flammability
Dostupné jazyky: Anglicky (v českom jazyku len titulná strana)
Dostupné prevedenie: Tlačené