ČSN EN IEC 62878-1

Device embedding assembly technology - Part 1: Generic specification for device embedded substrates

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Dostupné prevedenie: Tlačené

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Podrobné informácie

Označenie: ČSN EN IEC 62878-1

Dátum vydania: 01.04.2020

Stránok: 28

Krajina: Česká technická norma

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Anotácia

This part of IEC 62878 specifies the generic requirements and test methods for device-embedded substrates. The basic test methods for printed board substrate materials and substrates themselves are specified in IEC 61189-3.
This part of IEC 62878 is applicable to device-embedded substrates fabricated by use of organic base material, which includes, for example, active or passive devices, discrete components formed in the fabrication process of electronic printed boards, and sheet-formed components.
The IEC 62878 series applies neither to the re-distribution layer (RDL) nor to electronic modules defined in IEC 62421

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