IEC/TS 63444-ed.2.0-RLV

Podrobné informácie

Označenie: IEC/TS 63444-ed.2.0-RLV

Dátum vydania: 04.06.2026

Stránok: 120

Krajina: Medzinárodná technická norma

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Anotácia

IEC TS 63444:2026 RLV contains both the official IEC International Standard and its Redline version. The Redline version is available in English only and provides you with a quick and easy way to compare all the changes between the official IEC Standard and its previous edition. IEC TS 63444:2026 is applicable to process automation equipment using a 10BASE-T1L compliant Physical Layer (PHY). Ethernet-APL intrinsically safe profiles with different predefined entity or limitation parameters (for example voltage, current, power, capacitance, inductance, cable length) simplify the examination of the interconnection of different Ethernet-APL ports. Furthermore, this document is also applicable to factory and building automation and control equipment using a 10BASE-T1L compliant, and Power over Data Lines (PoDL) compliant Physical Layer (PHY) for non-intrinsically safe Ethernet installations. NOTE In this document the term Ethernet-SPE is used for PoDL compliant PHY. The following technical features are part of this document: - topology with trunk and spur installation capability; - 2-wire technology (full-duplex communication data rate of 10 Mbit/s); - long distance (refers to cable lengths of several hundred meters, with spans up to 1 000 m); - intrinsic safety (installation of Ethernet-capable field devices in hazardous areas); - power supply to field devices over the same 2-wire cable used for data communication; - non-intrinsically safe Ethernet installation in factory and building automation. This second edition cancels and replaces the first edition published in 2023. This edition constitutes a technical revision. This edition includes the following significant technical changes with respect to the previous edition: a) new power class for Ethernet-APL; b) addition of Ethernet-SPE; c) clarification of usability of Ethernet-APL in non-hazardous locations.