IEC 62137-1-2-ed.1.0

Podrobné informace

Označení: IEC 62137-1-2-ed.1.0

Datum vydání: 25.07.2007

Stran: 33

Země: Mezinárodní technická norma

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Anotace

The test method described in IEC 62137-1-2:2007 is applicable to leadless surface mounting components and surface mounting connectors to which pull test is not applicable. It is not applicable to multi-lead components and gull-wing leads. The method is designed to test and evaluate the endurance of the solder joint between component terminals and lands on a substrate, by means of a shear type mechanical stress. This test is applicable to evaluate the effects of repeated temperature change on the strength of the solder joints between terminals and lands on a substrate. La methode dessai decrite dans la CEI 62137-1-2:2007 est applicable aux composants montes en surface sans connexion et aux connecteurs montes en surface auxquels lessai a la traction nest pas applicable. Elle nest pas applicable aux composants a sorties multiples ni aux composants a sortie en aile de mouette. La methode est concue pour soumettre a essai et evaluer lendurance du joint brase entre les bornes des composants et les plages daccueil sur un substrat, au moyen dune contrainte mecanique de type cisaillement. Cet essai permet devaluer les effets de variations repetees de la temperature sur la resistance des joints brases entre les bornes et les plages daccueil sur un substrat.