STN - Slowakische nationale Normen

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-719: Test methods for interconnection structures (printed boards) - Monitoring of single plated-through hole (PTH) resistance change during temperature cycling

Verfügbare Sprachen: Englisch

Verfügbare Ausführung: Gedruckt

Test methods for electrical materials, interconnection structures and assemblies Part 5: Test methods for printed board assemblies

Verfügbare Sprachen: Englisch

Verfügbare Ausführung: Gedruckt

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies

Verfügbare Sprachen: Englisch

Verfügbare Ausführung: Gedruckt

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-2: General test methods for materials and assemblies - Soldering flux for printed board assemblies

Verfügbare Sprachen: Englisch

Verfügbare Ausführung: Gedruckt

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-3: General test methods for materials and assemblies - Soldering paste for printed board assemblies

Verfügbare Sprachen: Englisch

Verfügbare Ausführung: Gedruckt

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-4: General test methods for materials and assemblies - Solder alloys and fluxed and non-fluxed solid wire for printed board assemblies

Verfügbare Sprachen: Englisch

Verfügbare Ausführung: Gedruckt

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-301: General test methods for materials and assemblies - Soldering paste using fine solder particles

Verfügbare Sprachen: Englisch

Verfügbare Ausführung: Gedruckt

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-501: General test methods for materials and assemblies - Surface insulation resistance (SIR) testing of solder fluxes

Verfügbare Sprachen: Englisch

Verfügbare Ausführung: Gedruckt

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-502: General test methods for materials and assemblies - Surface insulation resistance (SIR) testing of assemblies

Verfügbare Sprachen: Englisch

Verfügbare Ausführung: Gedruckt

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-503: General test method for materials and assemblies - Conductive anodic filaments (CAF) testing of circuit boards

Verfügbare Sprachen: Englisch

Verfügbare Ausführung: Gedruckt