GB - Chinese national standards

Mechanical standardization of semiconductor devices—Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array (FBGA) and Fine-pitch Land Grid Array (FLGA)

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Mechanical standardization of semiconductor devices—Part 6-16: Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGA

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Mechanical standardization of semiconductor devices—Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages—Design guide for ball grid array (BGA)

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Mechanical standardization of semiconductor devices—Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages—Measuring methods for package dimensions of small outline J-lead packages SOJ

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Medical glass thermometer

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Potentiometers for use in electronic equipment--Part 3:Sectional specification--Rotary precision potentiometers

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Potentiometers for use in electronic equipment--Part 3:Blank detail specification--Rotary precision potentiometers--Assessment level E

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R.F. coaxial connectors type C

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R.F. coaxial connectors type UHF

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Limits of dimensions, axle load and masses for motor vehicles,trailers and combination vehicles

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