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GB - Chinese national standards
Page 594
GB/T 15874-1995 (22/12/1995)
General specification for trunked mobile communication system
Available languages: English, Chinese
Available design: electronic design (pdf), Print design
from 525.60 EUR more info
GB/T 15875-1995 (22/12/1995)
General specification for leaky cable radiocommunication system
Available languages: English, Chinese
Available design: electronic design (pdf), Print design
from 568.50 EUR more info
GB/T 15876-2015 (15/05/2015)
Semiconductor integrated circuits—Specification of leadframes for plastic quad flat package
Available languages: English, Chinese
Available design: electronic design (pdf), Print design
from 407.30 EUR more info
GB/T 15877-2013 (31/12/2013)
Semiconductor integrated circuits—Specification of DIP leadframes produced by etching
Available languages: English, Chinese
Available design: electronic design (pdf), Print design
from 246.10 EUR more info
GB/T 15878-2015 (15/05/2015)
Semiconductor integrated circuits—Specification of leadframes for small outline package
Available languages: English, Chinese
Available design: electronic design (pdf), Print design
from 364.30 EUR more info
GB/T 15879.4-2019 (30/08/2019)
Mechanical standardization of semiconductor devices—Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
Available languages: English, Chinese
Available design: electronic design (pdf), Print design
from 369.70 EUR more info
GB/T 15879.5-2018 (17/09/2018)
Mechanical standardization of semiconductor devices—Part 5: Recommendations applying to tape automated bonding(TAB) of integrated circuits
Available languages: English, Chinese
Available design: electronic design (pdf), Print design
from 815.70 EUR more info
GB/T 15879.603-2026 (30/07/2026)
Mechanical standardization of semiconductor devices—Part 6-3: General rules for the preparation of outline drawings of surface mounted semiconductor device packages—Measuring methods for package dimensions of quad flat packs (QFP)
Available languages: English, Chinese
Available design: electronic design (pdf), Print design
from 423.50 EUR more info
GB/T 15879.604-2023 (23/05/2023)
Mechanical standardization of semiconductor devices—Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages—Measuring methods for package dimensions of ball grid array (BGA)
Available languages: English, Chinese
Available design: electronic design (pdf), Print design
from 380.50 EUR more info
GB/T 15879.612-2025 (31/12/2025)
Mechanical standardization of semiconductor devices—Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages—Design guidelines for fine-pitch land grid array (FLGA)
Available languages: English, Chinese
Available design: electronic design (pdf), Print design
from 659.90 EUR more info
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