Potřebujeme Váš souhlas k využití jednotlivých dat, aby se Vám mimo jiné mohli ukazovat informace týkající se Vašich zájmů. Souhlas udělíte kliknutím na tlačítko „OK“.
Page 625
Specification for registration marks for photomasks
Available languages: English, Chinese
Available design: electronic design (pdf), Print design
Semiconductor integrated circuits—Specification of leadframes for plastic leaded chip carrier package
Available languages: English, Chinese
Available design: electronic design (pdf), Print design
Test method of measuring the lead-to-lead and loading capacitance of package leads
Available languages: English, Chinese
Available design: electronic design (pdf), Print design
Specification for photoresist/E-beam resist for hard surface photoplates
Available languages: English, Chinese
Available design: electronic design (pdf), Print design
Zinc oxide ceramics for use in varistors
Available languages: English, Chinese
Available design: electronic design (pdf), Print design
Splices for optical fibres and cables--Part 1:Generic specification--Hardware and accessories
Available languages: English, Chinese
Available design: electronic design (pdf), Print design
Optical cable closures—Part 1Generic specification
Available languages: English, Chinese
Available design: electronic design (pdf), Print design
Splices for optical fibres and cables--Part 2:Sectional specification--Splice organizers and closures for optical fibres and cables
Available languages: English, Chinese
Available design: electronic design (pdf), Print design
Splices for optical fibres and cables--Part 3:Sectional specification--Fusion splice organizers and closures for optical fibres and cables
Available languages: English, Chinese
Available design: electronic design (pdf), Print design
Splices for optical fibres and cables--Part 4:Sectional specification--Mechanical splices for optical fibres and cables
Available languages: English, Chinese
Available design: electronic design (pdf), Print design