ČSN - Czech national standards

Materials for printed boards and other interconnecting structures - Part 2-41: Reinforced base materials clad and unclad - Brominated epoxide cellulose paper/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly

Available languages: English (the title page in Czech only)

Available design: Print design

Materials for printed boards and other interconnecting structures - Part 2-42: Reinforced base materials clad and unclad - Brominated epoxide non-woven/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly

Available languages: English (the title page in Czech only)

Available design: Print design

Materials for printed boards and other interconnecting structures - Part 2-43: Reinforced base materials clad and unclad - Non-halogenated epoxide cellulose paper/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly

Available languages: English

Available design: Print design

Materials for printed boards and other interconnecting structures - Part 2-44: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly

Available languages: English

Available design: Print design

Materials for printed boards and other interconnecting structures - Part 2-45: Reinforced base materials clad and unclad - Nonhalogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity (1.0W/m K) and defined flammability (vertical burning test), copper-clad for lead-free assembly

Available languages: English

Available design: Print design

Materials for printed boards and other interconnecting structures - Part 2-46: Reinforced base materials clad and unclad - Nonhalogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity (1.5W/m K) and defined flammability (vertical burning test), copper-clad for lead-free assembly

Available languages: English

Available design: Print design

Materials for printed boards and other interconnecting structures - Part 2-47: Reinforced base materials clad and unclad - Nonhalogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity (2.0W/m K) and defined flammability (vertical burning test), copper-clad for lead-free assembly

Available languages: English

Available design: Print design

Materials for printed boards and other interconnecting structures - Part 2-51: Reinforced base materials, clad and unclad - Base materials for integrated circuit card carrier tape, unclad

Available languages: English

Available design: Print design

Materials for printed boards and other interconnecting structures - Part 2-52: Reinforced base materials clad and unclad - Thermosetting hydrocarbon resin system, woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad

Available languages: English

Available design: Print design

Materials for printed boards and other interconnecting structures - Part 2-53: Reinforced base materials clad and unclad - PTFE unfilled laminate sheets of defined flammability (vertical burning test), copper-clad

Available languages: English

Available design: Print design