IEC - International electro-technical commission

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-914: Test method for thermal conductivity of printed circuit boards for high-brightness LEDs - Guidelines

Available languages: English

Available design: electronic design (pdf), Print design, CD-ROM

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)
(Methodes d´essai pour les materiaux electriques, les cartes imprimees et autres structures d´interconnexion et ensembles - Partie 3: Methodes d´essai des structures d´interconnexion (cartes imprimees))

Available languages: English, English and French

Available design: electronic design (pdf), Print design, CD-ROM

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies
(Methodes d´essai pour les materiaux electriques, les cartes imprimees et autres structures d´interconnexion et ensembles - Partie 5-1: Methodes d´essai generales pour les materiaux et les assemblages - Lignes directrices pour les assemblages de cartes a circuit imprime)

Available languages: English and French

Available design: electronic design (pdf), Print design, CD-ROM

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-2: General test methods for materials and assemblies - Soldering flux for printed board assemblies
(Methodes d´essai pour les materiaux electriques, les cartes imprimees et autres structures d´interconnexion et ensembles - Partie 5-2: Methodes d´essai generales pour les materiaux et les assemblages - Flux de brasage pour les assemblages de cartes imprimees)

Available languages: English and French

Available design: electronic design (pdf), Print design, CD-ROM

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-3: General test methods for materials and assemblies - Soldering paste for printed board assemblies
(Methodes d´essai pour les materiaux electriques, les cartes imprimees et autres structures d´interconnexion et ensembles - Partie 5-3: Methodes d´essai des assemblages de cartes imprimees: Pate de brasage)

Available languages: English and French

Available design: electronic design (pdf), Print design, CD-ROM

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-301: General test methods for materials and assemblies - Soldering paste using fine solder particles
(Methodes d’essai pour les materiaux electriques, les cartes imprimees et autres structures d’interconnexion et ensembles - Partie 5-301: Methodes d’essai generales pour les materiaux et les assemblages - Pate a braser a fines particules de brasage)

Available languages: English and French

Available design: electronic design (pdf), Print design, CD-ROM

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-4: General test methods for materials and assemblies - Solder alloys and fluxed and non-fluxed solid wire for printed board assemblies
(Methodes d´essai pour les materiaux electriques, les cartes imprimees et autres structures d´interconnexion et ensembles - Partie 5-4: Methodes d´essai generales pour les materiaux et les assemblages - Alliages a braser et brasages solides fluxes et non fluxes pour les assemblages de cartes imprimees)

Available languages: English and French

Available design: electronic design (pdf), Print design, CD-ROM

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-501: General test methods for materials and assemblies - Surface insulation resistance (SIR) testing of solder fluxes
(Methodes d’essai pour les materiaux electriques, les cartes imprimees et autres structures d’interconnexion et ensembles - Partie 5-501: Methodes d’essai generales pour les materiaux et les ensembles - Essais de resistance d’isolement en surface (RIS) des flux de brasage)

Available languages: English and French

Available design: electronic design (pdf), Print design, CD-ROM

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-502: General test methods for materials and assemblies - Surface Insulation Resistance (SIR) testing of assemblies
(Methodes d’essai pour les materiaux electriques, les cartes imprimees et autres structures d’interconnexion et ensembles - Partie 5-502: Methodes d´essai generales pour les materiaux et les ensembles - Essais de resistance d´isolement en surface (RIS) des ensembles)

Available languages: English and French

Available design: electronic design (pdf), Print design, CD-ROM

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-503: General test method for materials and assemblies - Conductive anodic filaments (CAF) testing of circuit boards
(Methodes d’essai pour les materiaux electriques, les cartes imprimees et autres structures d’interconnexion et ensembles - Partie 5-503: Methode d’essai generale pour les materiaux et les assemblages – Essais des filaments anodiques conducteurs (CAF) des cartes a circuits)

Available languages: English, English and French

Available design: electronic design (pdf), Print design, CD-ROM