IEC - International electro-technical commission

Materials for printed boards and other interconnecting structures - Part 4-12: Sectional specification set for prepreg materials, unclad - Non-halogenated multifunctional epoxide woven E-glass prepreg of defined flammability
(Materiaux pour circuits imprimes et autres structures d´interconnexion - Partie 4-12: Serie de specifications intermediaires pour materiaux preimpregnes, non plaques - Tissu de verre epoxyde preimpregne multifonctionnel de type E non halogene, d´inflammabilite definie)

Available languages: English and French

Available design: electronic design (pdf), Print design, CD-ROM

Materials for printed boards and other interconnecting structures - Part 4-14: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
(Materiaux pour circuits imprimes et autres structures d´interconnexion - Partie 4-14: Serie de specifications intermediaires pour materiaux preimpregnes, non plaques (pour la fabrication des cartes multicouches) - Tissu de verre epoxyde preimpregne de type E d´inflammabilite definie (essai de combustion verticale) destine aux assemblages sans plomb)

Available languages: English, English and French

Available design: electronic design (pdf), Print design, CD-ROM

Materials for printed boards and other interconnecting structures - Part 4-15: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Multifunctional epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
(Materiaux pour cartes imprimees et autres structures d´interconnexion - Partie 4-15: Serie de specifications intermediaires pour materiaux preimpregnes, non plaques (pour la fabrication des cartes multicouches) - Tissu de verre epoxyde preimpregne multifonctionnel de type E d´inflammabilite definie (essai de combustion verticale) destine aux assemblages sans plomb)

Available languages: English, English and French

Available design: electronic design (pdf), Print design, CD-ROM

Materials for printed boards and other interconnecting structures - Part 4-16: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Multifunctional non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
(Materiaux pour cartes imprimees et autres structures d´interconexion - Partie 4-16: Serie de specifications intermediaires pour materiaux preimpregnes, non plaques (pour la fabrication des cartes multicouches) - Tissu de verre epoxyde preimpregne multifonctionnel non halogene de type E d´inflammabilite definie (essai de combustion verticale) destine aux assemblages sans plomb)

Available languages: English, English and French

Available design: electronic design (pdf), Print design, CD-ROM

Materials for printed boards and other interconnecting structures - Part 4-17: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
(Materiaux pour circuits imprimes et autres structures d´interconnexion - Partie 4-17: Serie de specifications intermediaires pour materiaux preimpregnes, non plaques (pour la fabrication des cartes multicouches) - Tissu de verre epoxyde preimpregne non halogene de type E d´inflammabilite definie (essai de combustion verticale) destine aux assemblages sans plomb)

Available languages: English, English and French

Available design: electronic design (pdf), Print design, CD-ROM

Materials for printed boards and other interconnecting structures - Part 4-18: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - High performance epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
(Materiaux pour circuits imprimes et autres structures d´interconnexion - Partie 4-18: Serie de specifications intermediaires pour materiaux preimpregnes, non plaques (pour la fabrication des cartes multicouches) - Tissu de verre epoxyde preimpregne de type E a haute performance, d´inflammabilite definie (essai de combustion verticale), pour les assemblages sans plomb)

Available languages: English and French

Available design: electronic design (pdf), Print design, CD-ROM

Materials for printed boards and other interconnecting structures - Part 4-19: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - High performance non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
(Materiaux pour circuits imprimes et autres structures d´interconnexion - Partie 4-19: Serie de specifications intermediaires pour materiaux preimpregnes, non plaques (pour la fabrication des cartes multicouches) - Tissu de verre epoxyde preimpregne non halogene de type E a haute performance, d´inflammabilite definie (essai de combustion verticale), pour les assemblages sans plomb)

Available languages: English and French

Available design: electronic design (pdf), Print design, CD-ROM

Materials for printed boards and other interconnecting structures - Part 4-2: Sectional specification set for prepreg materials, unclad - Multifunctional epoxide woven E-glass prepreg of defined flammability

Available languages: English

Available design: electronic design (pdf), Print design, CD-ROM

Materials for printed boards and other interconnecting structures - Part 4-5: Sectional specification set for prepreg materials, unclad - Polyimide, modified or unmodified, woven E-glass prepreg of defined flammability

Available languages: English

Available design: electronic design (pdf), Print design, CD-ROM

Materials for interconnection structures - Part 5: Sectional specification set for conductive foils and films with and without coatings - Section 1: Copper foils (for the manufacture of copper-clad base materials)
(Materiaux pour les structures d´interconnexion - Partie 5: Collection de specifications intermediaires pour feuilles et films conducteurs avec ou sans revetement - Section 1: Feuilles de cuivre (pour la fabrication de materiaux de base plaques cuivre))

Available languages: Spanish, English and French

Available design: electronic design (pdf), Print design, CD-ROM