IEC - International electro-technical commission

Materials for printed boards and other interconnecting structures - Part 2-5: Reinforced base materials, clad and unclad - Brominated epoxide cellulose paper reinforced core/woven E-glass reinforced surfaces laminated sheets of defined flammability (vertical burning test), copper-clad
(Materiaux pour circuits imprimes et autres structures d´interconnexion - Partie 2-5: Materiaux de base renforces, plaques et non-plaques - Feuilles stratifiees avec couches centrales renforcees en papier cellulose epoxyde brome et couches superficielles renforcees en tissu de verre de type E epoxyde, d´inflammabilite definie (essai de combustion verticale), plaquees cuivre)

Available languages: Spanish, English and French

Available design: electronic design (pdf), Print design, CD-ROM

Materials for printed boards and other interconnecting structures - Part 2-51: Reinforced base materials, clad and unclad - Base materials for integrated circuit card carrier tape, unclad
(Materiaux pour circuits imprimes et autres structures d’interconnexion - Partie 2-51: Materiaux de base renforces, plaques et non plaques - Materiaux de base pour bande support de carte a circuit integre, non plaques)

Available languages: English and French

Available design: electronic design (pdf), Print design, CD-ROM

Materials for printed boards and other interconnecting structures - Part 2-52: Reinforced base materials clad and unclad - Thermosetting hydrocarbon resin system, woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad
(Materiaux pour circuits imprimes et autres structures d’interconnexion - Partie 2-52: Materiaux de base renforces, metallises et non metallises - Feuilles stratifiees renforcees en tissu de verre de type E avec systeme de resines d´hydrocarbure thermodurcissables, d’inflammabilite definie (essai de combustion verticale), plaquees cuivre)

Available languages: English, French, English and French

Available design: electronic design (pdf), Print design, CD-ROM

Materials for printed boards and other interconnecting structures - Part 2-53: Reinforced base materials clad and unclad - PTFE unfilled laminate sheets of defined flammability (vertical burning test), copper-clad
(Materiaux pour circuits imprimes et autres structures d’interconnexion - Partie 2-53: Materiaux de base renforces, metallises et non metallises - Feuilles stratifiees non chargees en PTFE d’inflammabilite definie (essai de combustion verticale), plaquees cuivre)

Available languages: English, French, English and French

Available design: electronic design (pdf), Print design, CD-ROM

Materials for printed boards and other interconnecting structures - Part 2-6: Reinforced base materials, clad and unclad - Brominated epoxide non-woven/woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad
(Materiaux pour circuits imprimes et autres structures d´interconnexion - Partie 2-6: Materiaux de base renforces, plaques et non plaques - Feuilles stratifiees renforcees en verre de type E epoxyde brome tisse/non tisse, d´inflammabilite definie (essai de combustion verticale), plaquees cuivre)

Available languages: Spanish, English and French

Available design: electronic design (pdf), Print design, CD-ROM

Materials for printed boards and other interconnecting structures - Part 2-7: Reinforced base materials clad and unclad - Epoxide woven E-glass laminated sheet of defined flammability (vertical burning test), copper-clad
(Materiaux pour circuits imprimes et autres structures d´interconnexion - Partie 2-7: Materiaux de base renforces, plaques et non plaques - Feuille stratifiee tissee de verre E avec de la resine epoxyde, d´inflammabilite definie (essai de combustion verticale), plaquee cuivre)

Available languages: English and French

Available design: electronic design (pdf), Print design, CD-ROM

Materials for printed boards and other interconnecting structures - Part 2-8: Reinforced base materials clad and unclad - Modified brominated epoxide woven fibreglass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad
(Materiaux pour circuits imprimes et autres structures d´interconnexion - Partie 2-8: Materiaux de base renforces, plaques et non plaques - Feuilles stratifiees renforcees en tissu de fibres de verre epoxyde brome modifie, d´inflammabilite definie (essai de combustion verticale), plaquees cuivre)

Available languages: Spanish, English and French

Available design: electronic design (pdf), Print design, CD-ROM

Materials for printed boards and other interconnecting structures - Part 2-9: Reinforced base materials, clad and unclad - Bismaleimide/triazine modified epoxide or unmodified, woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad
(Materiaux pour circuits imprimes et autres structures d´interconnexion - Partie 2-9: Materiaux de base renforces, plaques et non plaques - Feuilles stratifiees renforcees en tissu de verre de type E epoxyde, modifie ou non, et bismaleimide/triazine, d´inflammabilite definie (essai de combustion verticale), plaquees cuivre)

Available languages: Spanish, English and French

Available design: electronic design (pdf), Print design, CD-ROM

Materials for printed boards and other interconnecting structures - Part 3-3: Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards) - Adhesive coated flexible polyester film
(Materiaux pour circuits imprimes et autres structures d´interconnexion - Partie 3-3: Collection de specifications intermediaires pour les materiaux de base non renforces, recouverts ou non (prevus pour les circuits imprimes flexibles) - Film flexible de polyester a revetement adhesif)

Available languages: English, Spanish, English and French

Available design: electronic design (pdf), Print design, CD-ROM

Materials for printed boards and other interconnecting structures - Part 3-4: Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards) - Adhesive coated flexible polyimide film
(Materiaux pour circuits imprimes et autres structures d´interconnexion - Partie 3-4: Collection de specifications intermediaires pour les materiaux de base non renforces, recouverts ou non (prevus pour les circuits imprimes flexibles) - Film flexible polyimide a revetement adhesif)

Available languages: English, Spanish, English and French

Available design: electronic design (pdf), Print design, CD-ROM