Withdrawn | Published: 10/10/1999

ASTM D5109-99 Withdrawn

Standard Test Methods for Copper-Clad Thermosetting Laminates for Printed Wiring Boards

Available languages: English

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Detail information

Designation: ASTM D5109-99

Publication date: 10/10/1999

Pages: 8

Note: Withdrawn

Country: American technical standard

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Anotation

Keywords:
Copper-clad materials Electrical properties Fiber reinforced polymers Industrial laminate Laminates-electrical insulation Polymers-electrical insulation applications Printed circuits Rigid laminate Thermosetting materials/properties Wiring boards copper-clad laminates-testing, from fiber-reinforced thermosetting polymers for printed wiring boards, Crosswise dimensional instability Dimensional instability Instability Lengthwise d

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