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Withdrawn | Published: 10/06/1997
ASTM F1390-97 Withdrawn
Standard Test Method for Measuring Warp on Silicon Wafers by Automated Noncontact Scanning
Available languages: English
Available design: Online Secure PDF
from 77.80 EUR
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Detail information
Designation: ASTM F1390-97
Publication date: 10/06/1997
Pages: 9
Note: Withdrawn
Country: American technical standard
Where to buy?
You can buy at www.mystandards.bizAnotation
Keywords:noncontact measurement, semiconductor, shape, silicon, wafers, warp, ICS Number Code 29.045 (Semiconducting materials)
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