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Active standard | Published: 17/04/2019
BS IEC 62047-31:2019
Semiconductor devices. Micro-electromechanical devices. Four-point bending test method for interfacial adhesion energy of layered MEMS materials.
Available languages: English
Available design: PDF - Immediate download, Print design
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Detail information
Designation: BS IEC 62047-31:2019
Publication date: 17/04/2019
Pages: 16
Country: British technical standard
Where to buy?
You can buy at www.mystandards.bizAnotation
ISBN: 978 0 580 96660 6 Status: DefinitivePopular Publishers
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