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Active standard | Published: 01/01/2004
ČSN EN 60191-6-4
Mechanical standardization of semiconductor devices - Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of ball grid array (BGA)
Available languages: English (the title page in Czech only)
Available design: Print design
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Detail information
Designation: ČSN EN 60191-6-4
Publication date: 01/01/2004
Pages: 24
Country: Czech technical standard
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