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Withdrawn | Published: 01/12/2003
ČSN EN 60749-20 Withdrawn
Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic-encapsulated SMDs to the combined effect of moisture and soldering heat
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Detail information
Designation: ČSN EN 60749-20
Publication date: 01/12/2003
Pages: 60
Note: Withdrawn
Country: Czech technical standard
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