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Active standard | Published: 01/05/2026
ČSN EN IEC 61189-3-302
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-302: Detection of plating defects in unpopulated circuit boards by computed tomography (CT)
Available languages: English
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Detail information
Designation: ČSN EN IEC 61189-3-302
Publication date: 01/05/2026
Pages: 28
Country: Czech technical standard
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This part of IEC 61189 describes a method for the detection of plating defects in unpopulated circuit boards using computed tomography (CT). This document is applicable to non-destructive testing of metallized holesPopular Publishers
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