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Withdrawn | Published: 01/01/1996
ČSN IEC 249-3-1 Withdrawn
Base materials for printed circuits. Part 3: Special materials used in connection with printed circuits. Specification No. 1: Prepreg for use as bonding sheet material in the fabrication of multilayer printed boards
Available design: Print design
from 8.90 USD
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Detail information
Designation: ČSN IEC 249-3-1
Publication date: 01/01/1996
Pages: 12
Note: Withdrawn
Country: Czech technical standard
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