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Active standard | Published: 30/07/2026
GB/T 15879.603-2026
Mechanical standardization of semiconductor devices—Part 6-3: General rules for the preparation of outline drawings of surface mounted semiconductor device packages—Measuring methods for package dimensions of quad flat packs (QFP)
Available languages: English, Chinese
Available design: electronic design (pdf), Print design
from 423.50 EUR
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Detail information
Designation: GB/T 15879.603-2026
Publication date: 30/07/2026
Pages: 0
Country: Chinese technical standard
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