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Active standard | Published: 20/03/2019
IEC/TR 62878-2-7-ed.1.0
Device embedding assembly technology - Part 2-7: Guidelines - Accelerated stress testing of passive embedded circuit boards
Available languages: English
Available design: electronic design (pdf), Print design, CD-ROM
from 117.70 USD
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Detail information
Designation: IEC/TR 62878-2-7-ed.1.0
Publication date: 20/03/2019
Pages: 12
Country: International technical standard
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IEC TR 62878-2-7:2019 (E) describes the accelerated stress testing of passive embedded circuit boards. It can be used for screening finished boards, including multilayer and high-density interconnection (HDI) boards. These boards are mainly for mobile devices.Popular Publishers
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