Active standard | Published: 11/10/2022

IEC/TR 63357-ed.1.0

Semiconductor devices - Standardization roadmap of fault test method for automotive vehicles

Available languages: English

Available design: electronic design (pdf), Print design, CD-ROM

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Detail information

Designation: IEC/TR 63357-ed.1.0

Publication date: 11/10/2022

Pages: 0

Country: International technical standard

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Anotation

IEC TR 63357:2022(E) describes standardization roadmap of fault test methods for integrated circuits used in automotive vehicles. Since automotive vehicles are exposed in harsh environment such as very low or high temperature, vibration, high frequency signals, etc. Therefore, they are tested for possible faults which can be caused by harsh environment. There are several fault test methods and related issues to be standardized. Semiconductor devices used in automotive vehicles are exposed in harsh environment of very high or very low temperature, vibration, high frequency signals, etc. Therefore, they are tested for possible faults which can be caused by harsh environment Evaluation results following this fault test methods will provide robustness of the semiconductor device.

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