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Active standard | Published: 14/12/2021
IEC/TR 63378-1-ed.1.0
Thermal standardization on semiconductor packages - Part 1: Thermal resistance and thermal parameter of BGA, QFP type semiconductor packages
Available languages: English
Available design: electronic design (pdf), Print design, CD-ROM
from 148.30 EUR
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Detail information
Designation: IEC/TR 63378-1-ed.1.0
Publication date: 14/12/2021
Pages: 20
Country: International technical standard
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You can buy at www.mystandards.bizAnotation
IEC TR 63378-1:2021(E) specifies the terms and definitions that are commonly used for thermal characteristics of BGA and QFP type semiconductor packages, and guidelines to use these thermal characteristics.Popular Publishers
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