Active standard | Published: 23/04/1997

IEC 60191-5-ed.2.0

Mechanical standardization of semiconductor devices - Part 5: Recommendations applying to integrated circuit packages using tape automated bonding (TAB)
(Normalisation mecanique des dispositifs a semiconducteurs - Partie 5: Recommandations applicables aux boitiers a transfert automatise sur bande (TAB) des circuits integres)

Available languages: English and French

Available design: electronic design (pdf), Print design, CD-ROM

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Detail information

Designation: IEC 60191-5-ed.2.0

Publication date: 23/04/1997

Pages: 71

Country: International technical standard

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Anotation

Gives recommendations applying to integrated circuits supplied in packages using tape automated bonding (TAB) as the principal component for structural and interconnection functions. Covers the requirements for tape with bonded integrated circuits (IC) as supplied by a manufacturer to a user. Donne des recommandations applicables aux circuits integres qui sont fournis dans les boitiers utilisant le transfert automatique sur bande (TAB) comme composant principal de fonctions structurales et dinterconnexion. Couvre les exigences pour les bandes avec circuits integres (IC) soudes telles que fournies par un fabricant a un utilisateur.

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