Active standard | Published: 19/11/2003

IEC 60191-6-10-ed.1.0

Mechanical standardization of semiconductor devices - Part 6-10: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Dimensions of P-VSON
(Normalisation mecanique des dispositifs a semiconducteurs - Partie 6-10: Regles generales pour la preparation des dessins d´encombrement des dispositifs a semiconducteurs pour montage en surface - Dimensions des boitiers P-VSON)

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Available design: electronic design (pdf), Print design, CD-ROM

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Detail information

Designation: IEC 60191-6-10-ed.1.0

Publication date: 19/11/2003

Pages: 24

Country: International technical standard

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Anotation

IEC 60191-6-10:2003 provides the common outline drawings and dimensions for all types of structures and composed materials of plastic very thin small outline non-lead package (hereinafter called P-VSON). La CEI 60191-6-10:2003 fournit les dessins dencombrement et les dimensions courantes pour tous les types de structures et de materiaux composes de boitiers en plastique sans sortie, tres faible encombrement (appeles ci-apres P-VSON).

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