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Active standard | Published: 18/10/2002
IEC 60191-6-2-ed.1.0/Cor.1 Correction
Corrigendum 1 - Mechanical standardization of semiconductor devices - Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages
Available languages: English
Available design: electronic design (pdf), Print design, CD-ROM
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Detail information
Designation: IEC 60191-6-2-ed.1.0/Cor.1
Publication date: 18/10/2002
Pages: 0
Note: Correction
Country: International technical standard
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