Active standard | Published: 30/08/2010

IEC 60191-6-21-ed.1.0

Mechanical standardization of semiconductor devices - Part 6-21: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline packages (SOP)
(Normalisation mecanique des dispositifs a semiconducters - Partie 6-21: Regles generales pour la preparation des dessins d´encombrement des boitiers pour dispositifs a semiconducteurs pour montage en surface - Methodes de mesure pour les dimensions des boitiers de faible encombrement (SOP))

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Available design: electronic design (pdf), Print design, CD-ROM

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Detail information

Designation: IEC 60191-6-21-ed.1.0

Publication date: 30/08/2010

Pages: 28

Country: International technical standard

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Anotation

IEC 60191-6-21:2010 specifies methods to measure package dimensions of small outline packages (SOP), package outline form E in accordance to IEC 60191-4. La CEI 60191-6-21:2010 specifie les methodes destinees a mesurer les dimensions des boitiers de faible encombrement SOP, lencombrement des boitiers de forme E conformement a la CEI 60191-4.

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