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Active standard | Published: 11/12/2012
IEC 60191-6-22-ed.1.0
Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FLGA)
(Normalisation mecanique des dispositifs a semiconducteurs - Partie 6-22: Regles generales pour la preparation des dessins d´encombrement des dispositifs a semiconducteurs a montage en surface - Guide de conception pour les boitiers matriciels a billes et a pas fins en silicium et boitiers matriciels a zone de contact plate et a pas fins en silicium (S-FBGA et S-FLGA))
Available languages: English and French
Available design: electronic design (pdf), Print design, CD-ROM
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Detail information
Designation: IEC 60191-6-22-ed.1.0
Publication date: 11/12/2012
Pages: 34
Country: International technical standard
Where to buy?
You can buy at www.mystandards.bizAnotation
IEC 60191-6-22:2012 provides the outline drawings and dimensions common to silicon-based package structures and materials of ball grid array packages (BGA) and land grid array packages (LGA). La CEI 60191-6-22:2012 fournit les dessins dencombrement et les dimensions associees, communs aux structures et materiaux des boitiers en silicium des boitiers matriciels a billes (BGA, ball grid array) et des boitiers matriciels a zone de contact plate (LGA, land grid array).Popular Publishers
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