Active standard | Published: 13/02/2003

IEC 60749-19-ed.1.0

Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength
(Dispositifs a semiconducteurs - Methodes d´essais mecaniques et climatiques - Partie 19: Resistance de la pastille au cisaillement)

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Detail information

Designation: IEC 60749-19-ed.1.0

Publication date: 13/02/2003

Pages: 11

Country: International technical standard

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Anotation

Determines the integrity of materials and procedures used to attach semiconductor die to package headers or other substrates. Generally only applicable to cavity packages or as a process monitor. Determine la coherence des materiaux et des methodes dessai utilisees pour fixer les pastilles a semiconducteurs aux embases de boitiers ou autres substrats. Generalement applicable aux seuls boitiers a cavite ou comme moniteur de processus.

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