Active standard | Published: 26/06/2006

IEC 61163-1-ed.2.0

Reliability stress screening - Part 1: Repairable assemblies manufactured in lots
(Deverminage sous contraintes - Partie 1: Assemblages reparables fabriques en lots)

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Detail information

Designation: IEC 61163-1-ed.2.0

Publication date: 26/06/2006

Pages: 161

Country: International technical standard

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Anotation

This part of IEC 61163 describes particular methods to apply and optimize reliability stress screening processes for lots of repairable hardware assemblies, in cases where the assemblies have an unacceptably low reliability in the early failure period, and when other methods, such as reliability growth programmes and quality control techniques, are not applicable. La presente partie de la CEI 61163 decrit les methodes a suivre pour appliquer et optimiser des processus de deverminage sous contraintes de lots dassemblages reparables, lorsque le niveau de fiabilite de ces assemblages est trop faible et inacceptable pendant la periode de defaillances precoces et que dautres methodes telles que les programmes de croissance de fiabilite et techniques de maitrise de la qualite ne sont pas applicables

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