Active standard | Published: 24/06/2003

IEC 61188-5-2-ed.1.0

Printed boards and printed board assemblies - Design and use - Part 5-2: Attachment (land/joint) considerations - Discrete components
(Cartes imprimees et cartes imprimees equipees - Conception et utilisation - Partie 5-2: Considerations sur les liaisons pistes-soudures - Composants discrets)

Available languages: English and French

Available design: electronic design (pdf), Print design, CD-ROM

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Detail information

Designation: IEC 61188-5-2-ed.1.0

Publication date: 24/06/2003

Pages: 103

Country: International technical standard

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Anotation

Provides information on land pattern geometries used for the surface attachment of discrete electronic components. Provides the appropriate size, shape and tolerances of surface mount land patterns to ensure sufficient area for the appropriate solder fillet, and also allow for inspection, testing and rework of resulting solder joints. Donne des informations sur la geometrie des zones de report, en vue du soudage par refusion des divers composants discrets. Fournit les dimensions, formes et tolerances appropriees des zones de report pour montage en surface afin dassurer une surface suffisante pour le cordon de brasure et pour permettre linspection, les essais et les retouches des joints de brasure.

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