Active standard | Published: 25/03/2002

IEC 61190-1-1-ed.1.0

Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly
(Materiaux de fixation pour les assemblages electroniques - Partie 1-1: Exigences relatives aux flux de brasage pour les interconnexions de haute qualite dans les assemblages de composants electroniques)

Available languages: English and French

Available design: electronic design (pdf), Print design, CD-ROM

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Detail information

Designation: IEC 61190-1-1-ed.1.0

Publication date: 25/03/2002

Pages: 41

Country: International technical standard

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Anotation

Specifies general requirements for the classification and testing of soldering fluxes for high-quality interconnections in electronics assembly. This standard is a flux characterization, quality control, and procurement document for solder flux and flux containing material in electronics assembly technology. Specifie les exigences dordre general relatives a la classification et au controle des flux de brasage pour les interconnexions de haute qualite dans lassemblage des composants electroniques. La presente norme represente une caracterisation du flux, un controle de la qualite et un document de commande pour les flux a braser et les flux constitues de materiaux au sein de la technologie dassemblage des composants electroniques.

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