Active standard | Published: 03/03/2021

IEC 62899-202-7-ed.1.0

Printed electronics - Part 202-7: Materials - Printed film - Measurement of peel strength for printed layer on flexible substrate by 90° peel method

Available languages: English

Available design: electronic design (pdf), Print design, CD-ROM

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Detail information

Designation: IEC 62899-202-7-ed.1.0

Publication date: 03/03/2021

Pages: 12

Country: International technical standard

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Anotation

IEC 62899-202-7:2021(E) provides a test method to measure the peel strength of a printed layer on a flexible substrate. This method calls for peeling the flexible substrate instead of an additional metal electroplating on the printed layer. The method described in this document can be used to compare the peel strengths of the printed layers on the same flexible substrate and thickness conditions. It can be used when the adhesion between the printed layer and flexible substrate is weaker than any other interface between the printed layer and the adhesive, the adhesive and the panel.

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