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Active standard | Published: 20/12/2011
JIS C61191-6:2011
Printed board assemblies -- Part 6: Evaluation criteria for voids in soldered joints of BGA and LGA and measurement method
Available languages: Japanese
Available design: electronic design (pdf), Print design
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Detail information
Designation: JIS C61191-6:2011
Publication date: 20/12/2011
Pages: 34
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