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Active standard | Published: 01/04/2002
STN EN 60191-6-3
Mechanical standardization of semiconductor devices. Part 6-3: General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Measuring methods for package dimensions of quad flat packs (QFP)
Available languages: English
Available design: Print design
Detail information
Designation: STN EN 60191-6-3
Publication date: 01/04/2002
Pages: 0
Country: Slovak technical standard
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