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Active standard | Published: 01/03/2004
STN EN 60191-6-4
Mechanical standardization of semiconductor devices Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of ball grid array (BGA)
Available languages: English
Available design: Print design
Detail information
Designation: STN EN 60191-6-4
Publication date: 01/03/2004
Pages: 19
Country: Slovak technical standard
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