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Active standard | Published: 01/02/2026
UNE-EN IEC 60749-22-1:2026
Semiconductor devices - Mechanical and climatic test methods - Part 22-1: Bond strength - Wire bond pull test methods (Endorsed by Asociación Espanola de Normalización in February of 2026.)
Available languages: English
Available design: electronic design (pdf), Print design
from 129.80 USD
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Detail information
Designation: UNE-EN IEC 60749-22-1:2026
Publication date: 01/02/2026
Pages: 70
Country: Spanish technical standard
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